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CMPW PAN TO BECOME TECHNICAL PATRON OF EXPOOPAKOWANIA PACKAGING FAIR

On 21-22 November 2017, the ExpoOPAKOWANIA Packaging Fair dedicated to key technologies and solutions in the field of packaging materials was held in at Expo Silesia in Sosnowiec.
The CMPW PAN, in response to the invitation by the President of the Management Board of Expo Silesia, Eng. Ludomir Tyszyński, PhD, became a Technical Patron of the event.
On 22 November 2017, the second day of the Fair, the CMPW PAN organised a nationwide seminar "Contemporary packaging – development prospects".

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